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xMEMS Expands Innovative Micro Cooling Fan on a Chip to AI Data Centers

xMEMS Labs is expanding its pioneering µCooling fan-on-a-chip platform to AI data centers, targeting thermal challenges in high-performance optical transceivers. This all-silicon MEMS-based micro fan delivers localized cooling for dense, power-intensive components like optical transceiver DSPs, enhancing performance and reliability. The solution’s compact, solid-state design enables maintenance-free, in-module cooling without compromising optics, addressing critical bottlenecks in next-gen AI infrastructure.

Published May 1, 2025 at 02:14 AM EDT in Data Infrastructure

xMEMS Labs, a leader in monolithic MEMS chip technology, has announced the expansion of its innovative µCooling fan-on-a-chip platform to AI data centers. This technology leverages Micro Electromechanical Systems (MEMS) to create tiny, all-silicon mechanical fans embedded directly on semiconductor chips, providing a new approach to thermal management in high-performance computing environments.

Originally developed for compact mobile devices, the µCooling platform now targets the thermal challenges inside 400G, 800G, and 1.6T optical transceivers used in AI data centers. These transceivers house dense, power-intensive components such as digital signal processors (DSPs) operating at thermal design powers (TDP) of 18W or higher, which conventional cooling systems struggle to manage effectively.

Unlike traditional cooling solutions that focus on large processors and GPUs, xMEMS’ µCooling delivers targeted, hyper-localized active cooling by pumping silent, vibration-free streams of high-velocity air pulses within the transceiver module. This approach reduces DSP operating temperatures by over 15% and thermal resistance by more than 20%, enabling higher sustained throughput, improved signal integrity, and longer module lifetimes.

A key innovation of the µCooling system is its dedicated, isolated airflow channel that is thermally coupled to heat sources but physically separated from optical components. This design preserves signal clarity and reliability by protecting sensitive optics from dust and contamination while delivering effective cooling performance.

Market forecasts predict rapid growth in high-speed optical connectivity, with shipments of 800G and 1.6T transceivers expected to grow at over 35% CAGR through 2028. As these modules increase in power and density, thermal management becomes a critical barrier to performance and adoption. xMEMS’ solid-state piezoMEMS design eliminates moving parts, ensuring maintenance-free reliability and scalable manufacturing suitable for various form factors including QSFP-DD and OSFP.

By extending µCooling from mobile devices to AI data centers, xMEMS is addressing a critical need for scalable, efficient thermal solutions that unlock higher performance in next-generation electronics. This technology exemplifies how innovative MEMS platforms can transform thermal management, enabling more reliable, higher throughput AI infrastructure.

For developers, data center architects, and technology leaders, integrating MEMS-based active cooling solutions like xMEMS µCooling offers a path to overcoming thermal bottlenecks that limit optical transceiver performance. This innovation supports the growing demands of AI workloads by enhancing component reliability and enabling sustained high data rates in compact, power-dense environments.

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